Thermal Compound

Cooler Master Thermal Paste HTK-002 View larger

Cooler Master Thermal Paste HTK-002


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Cooler Master Thermal Paste HTK-002

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R 59.00 tax incl.

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Cooler Master PTK-002 Thermal Interface Material is a grease-like product that contains silicon material and is filled with thermally conductive and electrically insulating ceramics. Silicone compound provides appropriate viscosity for best interface between heat sink and heat-generating devices. The unique filler recipe of PTK-002 provides high thermal conductivity, best thermal stability, and excellent electrical properties over a wide range of temperatures. It is ideal for heat transfer between heat sink and electronic devices.



Suitable for CPU, chipsets on Mainboard, VGA card, etc.
Easy to use.
Zif Socket Templates ensure correct applying area with various CPU socket types.
Produces an even layer when using applicator.
Wide range of application temperature.




Color Gray


Specific Gravity 2.63 g/cm3


Shelf Life 24 months from DOM


Volume Resistivity 5.0 x 1015 ?cm


Viscosity (@25°C) 1400 P


Bulk Thermal Conductivity >4.5 W/m-K


Thermal Impedance ~0.02 C-in/W


Dielectric Properties (Dielectric constant @ 25°C, 100Hz)


Insulating >6


Evaporation (200°C x 24hr) <0.35%


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